EFFECT OF FILL RATIO ON EVAPORATOR WALL TEMPERATURE IN A LOOP THERMOSYPHON USED IN ELECTRONIC COOLING APPLICATIONS

المؤلفون

  • Samah Ihsan Adnan Mechanical Engineering Department, College of Engineering, Mustansiriyah University, Baghdad, Iraq مؤلف
  • Aouf Abdulrahman Ahmad Mechanical Engineering Department, College of Engineering, Mustansiriyah University, Baghdad, Iraq مؤلف
  • Adnan Adulamir Abdulrasool Mechanical Engineering Department, College of Engineering, Mustansiriyah University, Baghdad, Iraq مؤلف

DOI:

https://doi.org/10.31272/jeasd.24.2.2

الكلمات المفتاحية:

loop heat pipe، thermosyphon، fill ratio، saturation temperature

الملخص

This paper presents the effect of filling ratio on thermal performance;of a loop thermosyphon. The experimental setup consists of an evaporator, a condenser, a riser and a downcomer. The dimensions of the loop thermosyphon under consideration were chosen so that they are mostly suitable for use in the cooling of electronic components. Distilled water was used as a working fluid. Experiments were carried out to estimate the performance of the loop thermosyphon for a range of input power from 10 to 100 W. Four fill ratios were considered in the present work, namely; 15%, 25%, 50% and 85%. Results showed that the maximum value of wall temperature in evaporator was 95°C, at 100 W input power and 15% fill ratio. The fill ratio of 50% gave the minimum evaporator wall temperature which was 80°C. Increasing fill ratio tends to decrease the evaporator wall temperature for evaporator.

 

التنزيلات

Key Dates

منشور

2020-03-01

إصدار

مجلد 24 عدد 2 (2020): Journal of Engineering and Sustainable Development

القسم

Articles

الرخصة

Creative Commons License

هذا العمل مرخص بموجب Creative Commons Attribution 4.0 International License.

The Journal of Engineering and Sustainable Development is an open-access journal that all contents are free of charge. Articles of this journal are licensed under the terms of the Creative Commons Attribution International Public License CC-BY 4.0 (https://creativecommons.org/licenses/by/4.0/legalcode) that licensees are unrestrictly allowed to search, download, share, distribute, print, or link to the full texts of the articles, crawl them for indexing and reproduce any medium of the articles provided that they give the author(s) proper credits (citation). The journal allows the author(s) to retain the copyright of their published article.
Creative Commons-Attribution (BY)

كيفية الاقتباس

Ihsan Adnan, S. ., Abdulrahman Ahmad, A. ., & Adulamir Abdulrasool, A. . (2020). EFFECT OF FILL RATIO ON EVAPORATOR WALL TEMPERATURE IN A LOOP THERMOSYPHON USED IN ELECTRONIC COOLING APPLICATIONS. مجلة الهندسة والتنمية المستدامة, 24(2), 18-29. https://doi.org/10.31272/jeasd.24.2.2

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