EFFECT OF FILL RATIO ON EVAPORATOR WALL TEMPERATURE IN A LOOP THERMOSYPHON USED IN ELECTRONIC COOLING APPLICATIONS

Abstract

This paper presents the effect of filling ratio on thermal performance;of a loop thermosyphon. The experimental setup consists of an evaporator, a condenser, a riser and a downcomer. The dimensions of the loop thermosyphon under consideration were chosen so that they are mostly suitable for use in the cooling of electronic components. Distilled water was used as a working fluid. Experiments were carried out to estimate the performance of the loop thermosyphon for a range of input power from 10 to 100 W. Four fill ratios were considered in the present work, namely; 15%, 25%, 50% and 85%. Results showed that the maximum value of wall temperature in evaporator was 95°C, at 100 W input power and 15% fill ratio. The fill ratio of 50% gave the minimum evaporator wall temperature which was 80°C. Increasing fill ratio tends to decrease the evaporator wall temperature for evaporator.