EFFECT OF FILL RATIO ON EVAPORATOR WALL TEMPERATURE IN A LOOP THERMOSYPHON USED IN ELECTRONIC COOLING APPLICATIONS. J. eng. sustain. dev. [انترنت]. 1 مارس، 2020 [وثق 3 يوليو، 2024];24(2):18-29. موجود في: https://jeasd.uomustansiriyah.edu.iq/index.php/jeasd/article/view/145