“ EFFECT OF FILL RATIO ON EVAPORATOR WALL TEMPERATURE IN A LOOP THERMOSYPHON USED IN ELECTRONIC COOLING APPLICATIONS”. Journal of Engineering and Sustainable Development 24, no. 2 (March 1, 2020): 18–29. Accessed July 3, 2024. https://jeasd.uomustansiriyah.edu.iq/index.php/jeasd/article/view/145.