EFFECT OF FILL RATIO ON EVAPORATOR WALL TEMPERATURE IN A LOOP THERMOSYPHON USED IN ELECTRONIC COOLING APPLICATIONS. Journal of Engineering and Sustainable Development, [S. l.], v. 24, n. 2, p. 18–29, 2020. DOI: 10.31272/jeasd.24.2.2. Disponível em: https://jeasd.uomustansiriyah.edu.iq/index.php/jeasd/article/view/145.. Acesso em: 3 jul. 2024.